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Online Catalogue | Other | Heatsink Paste
Ref: ACO-HSF-PRT6
Antec heat paste formula 5 transfer heat from proccessor to heatsink/fan
Ref: AK-TT12-80
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Akasa Double Sided Thermal Adhesive Tape Is A Highly Effective Way to Bond Heatsinks To Chipsets Or Other Components Req
Ref: ARCTIC SILVER 5
3.5g .With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arc
Ref: ARCTICLEAN
ArctiClean is a two-step cleaning process that removes existing thermal grease or pads and prepares the thermal surface
Ref: FORMULA5STC
Formula 5 Antec silver thermal compound. Lowers your cpu core temperature by up to 10 degrees C. Features 99.9% pure mic
Ref: MX24G
Arctic Cooling MX-2 Thermal Compound Designed Specificlly For High End Requirements. Compatible With GPUs As Well As CPU
Ref: MX44G
Arctic Cooling MX-4 Thermal Compound Designed Specificlly For High End Requirements. Compatible With GPUs As Well As CPU
Ref: SP-456
Spire 30% silver based thermal heatsinc paste used between proccessors and heatsinks Thermal Conductivity >3.8 W/m-K
Ref: THERMAL PAD
Double Sided Self-Adhesive Thermal Pad For Use On Proccessors And GPUs Etc.
Ref: THERMALCOMPOUND
SpireThermal paste to transfer heat from processor to heatsink.Thermal Conductivity: 1.729 W/m-K
Ref: SP-802
Spire thermal heatsinc paste used between proccessors and heatsinks Thermal Conductivity >2.7 W/m-K
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